NES-12 06 01-14.1 - 3D System Integration and 3D Technologies
This lecture provides knowledge in the area of modern 3D system integration technologies, which is a special branch of the electronics packaging. Starting with the explanation of different 3D concepts, the main technological steps and challenges of the vertical interconnect approach by through silicon via (TSV) fabrication are introduced. Furthermore the TSV plating and bump fabrication, thinning of the wafer as well as stacking procedures will be explained. Different bonding technologies (metal diffusion, solid-liquid interdiffusion and hybrid) will also be described.