EuI-NES-E-MSI, EuI-ET-E-Hybri - Lecture "System Integration Technologies"

This lecture provides knowledge in the area of modern advanced packaging technologies, such as 2.5D and 3D system integration technologies. Starting with explanation of the different 2.5D and 3D concepts, the main technological steps and challenges of the vertical interconnect or through silicon via (TSV) fabrication are introduced. Further the TSV plating and Cu/solder bump fabrication, thinning of the wafer as well as stacking procedures will be explained. Different wafer bonding technologies (metal diffusion, solid-liquid interdiffusion and hybrid) will be described in detail.