EuI-NES-E-3DSI - Micro-/Nanomaterials and Reliability Aspects

This lecture deals with material systems typically used for 3D system integration. Metallic materials such as Cu and solder alloys as well as new nanomaterials (like nanocomposites, functional layers, and  nanoporous materials) and their application in interconnects will be the focus of this lecture. Microelectronic devices consist of a large number of material interfaces, which are affected by thermo-mechanical stress due to differences in their mechanical properties. Their failure and reliability issues have to be considered in order to maintain the functionality of 3D systems for the planned lifetime of the electronic component. These reliability aspects will be discussed in terms of material combinations, processing and application.